Commensurate with experience; comprehensive benefits package
Description:
This position will be primarily responsible for developing semiconductor package solutions for new products using technologies such as laminate BGAs, QFN, stacked die, and wafer level packages.
Responsibilities:
Will work with product groups and contract manufacturers to design, characterize, qualify and implement package into production.
Will be responsible for overall project schedule in addition to package requirements including electrical and thermal characteristics, quality specifications and cost structure.
Limited travel required.
Qualifications:
B.S./M.S. ME, EE, Materials Science or Equivalent.
5-10 years relevant experience.
Excellent communication skills.
Experience with off-shore contract manufacturing.
Experience with design tools such as Ansys, Flowtherm.
